APIC 2010: Asia's most widely attended International Conference on Applied Surface Engineering

The primary purpose of joint-international conference is to bring together in Singapore the surface and interface engineering professionals and the end users of surface engineering and associated technologies to nurture exchange of noteworthy global initiatives for applied research and product development.

Coating Processes

Electroplating
Electroless plating
Immersion plating
Galvanising
Electroforming
Composite Charging
Sol-gel coating
PVD / CVD
Powder Coating

Characterization and Testing

Analysis and Characterization
Standardization and Testing
Failure Analysis

Surface Engineering Processes

Shot Peening
Surface Cleaning and preparation
Plasma Surface processing
Anodising
Heat Treatment

Plant and Equipment

New concepts to assist in Plating Cell Design
Equipment & Plant Innovation
Equipment & Plant Design for new applications
Pulse plating

Industry Applications

Electronics
Display Components
Advances in LED
Micro-Joining/PCB/MEMS
Automotive
Aerospace
Precision Engineering
BioMedical
Decorative and Functional Finishing
Photo-Voltaics & Solar Batteries

Business and Management

Roadmap of Surface Engineering
Legislation: ROHS/ WEEE/ REACH
Carbon footprint
Environment

Emerging Technologies

New Materials for surface coating
Nanotechology in Surface Finishing
Waste Water and Air Pollution filtration
Fuel Cells
Surface Technologies for Optics
Alternatives to ultra-thin Au thin films