Solder/Microsolder Interconnect /Reliability Relevance
Singapore : December 8th-11th 2015
Enhanced reliability of solder-substrate interface in flexible, bendable and wearable advanced electronic products is becoming a necessity with the inevitable integrated demands of Tsensors, IoT and eHealth.
This inaugural symposium provides an overview of technology trends, development challenges in methods, materials and applications in solder-joint engineering arena with special emphasis on upcoming technologies for electronic cluster industries.
The primary purpose is to bring together the solder/surface engineering professionals, the end users and ASEAN technologists in Singapore for R&D and business collaboration initiation. This inaugural platform also discusses current state of the art technologies, comprehensive applications and an update on the understanding of electronic package solder-joint reliability at micron/submicron landscape.
Technology topics to be addressed but not limited to
- Micro structural evolution and interfacial interactions in lead-free solder interconnects (LFSI)
- Lead-free solder joint reliability status and trends
- Chemical interactions and reliability testing for LFSI
- Tin Whisker growth on lead free solder finishes
- Accelerated testing methodology for LFSI.
- Thermomechanical reliability prediction, DfR, FEM of LFSI.
- Characterization and failure analysis of Lead free solder defects.
- LFSI reliability outlook at micron landscape.
- Surface finishing/coating development
- Surface finish at PCB and chip bond ( Substrate pad finish ( NiAu, OSP, SoP,ImSn, ENEPIG )
Technical Symposium
Keynote talk, invited presentations, poster contributions will be in 9-10 Dec 2015 from 0900am 0530pm.
Education Courses
Solder interconnect reliability is an integration of applied sciences and engineering and hence currently there is a need to groom engineers and researchers from various levels - technicians, graduate and postgraduates in multidisciplinary areas. The courses will be conducted at UTown, NUS from 0900am to 0530pm. They are
a) Solder and Solder – Surface Finish Reliability:
This topic will be conducted on Tuesday, 8th Dec 2015.
b) Practical Surface Engineering Process and Interface
Analysis:
This topic will be conducted on Friday, 11th Dec 2015.
Table-Top Exhibition
An exhibition will be held in conjunction with the symposium in UTown, NUS at Singapore. It will be open on 9-10th Dec 2015 from 1000am to 0500pm to facilitate a communication channel between the users and manufacturers in solder – Joint interconnect engineering technologies. If you wish to meet your potential customers and market your products/services face to face in a cost – effective way, mark your calendar. For information on how to exhibit, please contact the Secretariat.
Secretariat
The symposium is organized by NUS/Singapore, UMD/USA and A-IATS(Singapore) in association with SSEA. All correspondence should be addressed to :
The Symposium Secretariat
Advanced Integrated Analytical Test Services (S) PTE LTD
No 9, Kaki Bukit Road
#02-16 , Gordon Warehouse Building
Singapore 417842
Attention : Mr. Yaadhav Raaj or Ms Suzianna
Tel/Fax no : 6841 1236 / 6841 1237
Email : raj@a-iats.com
Website : http://www.a-iats.com/
or
The Chair, Organizing Committee
R. Gopala Krishnan PhD
Physics, NUS, Singapore
Email: phyrgk@nus.edu.sg